品牌:
Cypress Semiconductor (赛普拉斯)(2)
PRO Power(11)
WAGO(17)
3M(12)
Microchip (微芯)(23)
Amphenol (安费诺)(5)
Littelfuse (力特)(3)
Alpha Wire(40)
Eaton Bussmann (伊顿巴斯曼)(1)
Schneider Electric (施耐德)(6)
Raychem(1)
Intel (英特尔)(3)
Micron (镁光)(20)
Thomas & Betts(2)
Newport(1)
Molex (莫仕)(3)
Sensotec(1)
Richco(8)
IDEC(4)
Zarlink (英商卓联)(1)
TDK-EPC (爱普科斯)(1)
Xilinx (赛灵思)(1)
Rabbit Semiconductor(1)
Omron (欧姆龙)(9)
Cisco (思科)(1)
Renesas Electronics (瑞萨电子)(6)
Integrated Device Technology (艾迪悌)(1)
ADAM Technologies(3)
Lantiq(4)
OK International(3)
Fibox Enclosures(2)
ICCNexergy(1)
Hamlin Electronics(4)
Carlo Gavazzi (瑞士佳乐)(1)
Panasonic (松下)(2)
mikroElektronika(4)
TE Connectivity (泰科)(6)
Integrated Silicon Solution(ISSI)(2)
NXP (恩智浦)(1)
Tyco Electronics (泰科)(2)
Essentra Components(1)
Stackpole Electronics(2)
Semtech Corporation(1)
ITT Corporation (ITT电子)(4)
Motorola (摩托罗拉)(3)
Parvalux(1)
Philips (飞利浦)(1)
Vishay Sfernice (思芬尼)(2)
Phoenix (菲尼克斯)(3)
Camden(1)
Measurement Specialties (精量电子)(1)
Desco(5)
Harting Technology Group (哈丁电子)(1)
Kontron(1)
American Educational Products(7)
Weidmuller (魏德米勒)(1)
American Electronic Components(2)
Abbatron(2)
ITT Cannon (ITT科能)(2)
Apem Components(3)
Werma(1)
VAN Damme(1)
Leader Tech(3)
FerriShield(2)
Samsung (三星)(1)
EAO Switch(1)
Buchanan(1)
Broadcom (博通)(4)
Wiska(1)
Assmann WSW (阿斯曼制造)(1)
Banner(1)
Danaher(1)
Cooper Bussmann (库柏)(1)
Honeywell (霍尼韦尔)(4)
BEL Stewart(1)
AVAGO Technologies (安华高科)(1)
Chip Quik(1)
ST Microelectronics (意法半导体)(1)
National Semiconductor (美国国家半导体)(1)
Harwin(3)
TI (德州仪器)(1)
Emerson Network Power(1)
OmniVision Technologies (豪威科技)(1)
Lattice Semiconductor (莱迪思)(1)
muRata (村田)(1)
Multi-Tech Systems(1)
Jonard(1)
Switchcraft / Conxall(1)
Advantech (研华)(1)
Panduit (泛达)(1)
多选
封装:
100(304)
包装:
(304)
型号/品牌/封装
品类/描述
库存
价格(含税)
资料

©Copyright 2013-2025 亿配芯城(深圳)电子科技有限公司 粤ICP备17008354号

Scroll

对比栏

展开

对比

清空